PACKAGING PRINTING MACHINES
iFlex
KFlex
XFlex X6.0
XFlex X6 Offset
XFlex X7
Varyflex V2
Varyflex V4 Offset
Machines with Special Configurations
On February 6-7 an inaugural Future of Flexo event was hosted at Clemson University’s Sonoco Institute of Packaging Design and […]
In Italy, OMET invests in the future with Ribes Tech, the innovative start-up born from a collaboration between OMET and […]
Great turnout at the event organized by OMET on January 24th-25th, during which OMET inaugurated the new DROME demo center […]
A new laminating module to produce linerless labels. Here is the focus of the new partnership between OMET and Ritrama, […]
The “OMET Hybrid Experience” open house will focus on the opportunities offered by hybrid digital printing technology in the […]
CLEMSON, SC – OMET Americas, Inc. and Clemson University’s Sonoco Institute of Packaging Design and Graphics have partnered over the […]
Innovation doesn’t only means new products or processes, but also finding new applications to existing skills, in completely different contexts. […]
Innovation, technology and simplicity. Spotlight will be on the new OMET iFlex at Labelexpo India 2018, the most important fair […]